The 2CRD system is Novatec's standard platform for ultra-fine and high-precision cleaning. Four-tank design with cleaning and drying under vacuum, optionally with rotating or oscillating basket.
| Type | Basket size (W × D × H) | Motion |
|---|---|---|
| 2CRD-100 | 300 × 400 × 300 mm | Static |
| 2CRD-100-ROT | 220 × 320 × 200 mm | Rotating & swivel |
| 2CRD-200 | 400 × 600 × 430 mm | Static |
| 2CRD-200-ROT | 320 × 470 × 300 mm | Rotating & swivel |
| 2CRD-400 | 500 × 820 × 500 mm | Static |
| 2CRD-400-ROT | 470 × 670 × 300 mm | Rotating & swivel |
| 2CRD-800 | 600 × 1050 × 630 mm | Static |
| 2CRD-800-ROT | 600 × 800 × 400 mm | 2× 608 × 408 × 400 | Rotating & swivel |
* -ROT: rotating and oscillating basket with selectable direction of rotation.
The 2CRD single-chamber precision cleaning system comes standard with four tanks: two cleaning and two rinse tanks plus an additional fresh-water or ultra-pure-water rinse. Cleaning, rinsing and drying all run under vacuum or via the pressure-pulse process — so the cleaning and rinsing medium reaches even the finest holes, blind holes, undercuts and internal geometries. Ideal for fine and high-precision cleaning of complex-geometry parts.
Every tank has an absolute filter on the return line, tank 1 also has an oil separator and the final rinse bath (tank 4) is monitored by conductivity — so you reach component cleanliness in line with VDA 19 and ISO 16232 reproducibly. Control via colour graphic display (12" HMI) with 16 freely programmable cleaning programs, each with 16 sub-steps.
Available as options: rotating or swinging basket with selectable direction (-ROT version), pressure-pulse under vacuum as standard, hot-air or vacuum drying, and an optional cleanroom design. All process steps are combinable and repeatable — including two cleaning cycles in sequence with different chemistries.
Reproducible surface preparation with residues below detection limits. Validatable to customer specification.
Implants, surgical instruments, components — biocompatibly cleaned, fully documentable.
Components with bores, undercuts and tight tolerances. Pressure-cycle process when required.
Material-friendly chemistry per substrate. Aqueous or modified cleaning baths.
Low-particle precision cleaning of wafer-handling components, front-end hardware and vacuum-chamber parts. Cleanroom class 7 version available.
Punches, dies, injection molds — reaches every geometry without disassembly.
Send us samples — we'll clean, analyze and recommend the right size.
